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DPC (Direct Plated Copper)

  1. Ceramic Substrate Cleaning

    Remove contaminants such as particles, oils, and organic residues from the ceramic substrate surface to ensure excellent adhesion and reliability.

  2. Seed Layer Sputtering
    (Ti/Cu, TiW/Cu, Cr/Cu)

    Deposit a thin seed layer on the ceramic substrate surface by sputtering to provide conductivity and adhesion for copper plating.

  3. Photoresist Coating

    Apply photoresist evenly on the seed layer surface by spin coating.

  4. Exposure & Development

    Expose through a photomask using UV light,then develop the photoresist to form the desired circuit pattern.

  5. Copper Electroplating

    Electroplate copper onto the patterned areas to build up the circuit thickness as required.

  6. Photoresist Stripping

    Remove the remaining photoresist to expose th plated copper circuit.

  7. Seed Layer Etching

    Etch away the exposed seed layer (metal) in non-circuit areas to define the final circuit pattern.

  8. Photoresist Coating

    Apply surface finishing to improve solderability, corrosion resistance, and reliability.

  9. Exposure & Development

    Perform electrical testing and visual inspection (AOl) to ensure the product meets quality standards.

By integrating precision photolithography and electroplating technologies, DPC substrates can achieve exceptional circuit accuracy and excellent surface quality.

DBC ( Direct Bonded Copper )

The DBC process utilizes a copper-oxygen eutectic reaction at elevated temperatures to directly bond copper foil onto the ceramic substrate surface.

  1. Ceramic Substrate Cleaning

    Remove contaminants, particles and oil from the ceramic surface.

  2. Copper Foil Lamination

    Laminate high-purity copper foil onto the ceramic substrate with precise alignment.

  3. High-Temperature Eutectic Bonding

    Perform eutectic bonding in a high-temperature furnace to form a metallurgical bond.

  4. Circuit Pattern Etching

    Etch the copper layer to precise circuit patterns.

  5. Surface Finishing
    (Ni, Ni/Au, ENIG, ENEPIG)

    Apply surface finishing to enhance solderability,corrosion resistance and reliability.

  6. Inspection

    Perform visual inspection, AOl and electrical testing to ensure product quality.

The metallurgical bond formed between copper and ceramic provides exceptional thermal conductivity, mechanical strength, and long-term reliability under demanding operating conditions.

AMB (Active Metal Brazing )

AMB utilizes active brazing alloys containing Titanium (Ti) and other reactive elements. During the high-temperature vacuum brazing process, these active elements chemically react with the ceramic surface, creating a strong metallurgical bond between the copper foil and ceramic substrate.
  1. Ceramic Substrate Cleaning

    Remove contaminants such as particles, oils, and oxides from the ceramic surface to ensure strong bonding and high reliability.

  2. Active Brazing Alloy Coating

    Apply active brazing alloy (containing elements such as Ti) evenly on the ceramic substrate surface.

  3. Copper Foil Lamination

    Laminate high-purity copper foil onto the coated ceramic substrate with precise alignment.

  4. High-Temperature Vacuum Bonding

    Perform high-temperature vacuum brazing to achieve metallurgical bonding between copper foil and ceramic substrate.

  5. Circuit Pattern Etching

    Use photolithography and etching processes to form the desired circuit patterns with high precision.

  6. Surface Finishing
    (Ni, Ni/Au, ENIG, ENEPIG)

    Apply surface finishes such as Ni, Ni/Au, ENIG, or ENEPIG to improve solderability, corrosion resistance, and reliability.

  7. Inspection

    Perform AOI inspection to detect defects and ensure the product meets quality standards.

  8. Reliability Testing

    Conduct reliability tests such as thermal cycling, power cycling, and high-temperature storage to ensure long-term reliability.

Through chemical bonding at the ceramic-metal interface, AMB substrates achieve exceptional bond strength, thermal stability, and long-term reliability.

Thick Film Printing

Thick film technology utilizes precision screen printing to transfer conductive metal pastes onto ceramic surfaces. After high-temperature firing, the metal and ceramic form a stable bond with excellent adhesion and electrical conductivity.
Common conductive pastes include:

•Silver (Ag)
•Silver-Palladium (Ag/Pd)
•Gold (Au)
•Copper (Cu)

In addition to conductive layers, thick film technology can also print resistors, dielectric layers, insulation layers, and heating elements, enabling highly integrated circuit designs.
  1. Ceramic Substrate Cleaning

    Remove contaminants such as particles, oils and oxides from the ceramic substrate surface to ensure excellent adhesion and reliability.

  2. Screen Preparation

    and prepare high-precision screens according to circuit design requirements.

  3. Conductive Paste Printing

    Print conductive metal paste onto the ceramic substrate through the screen to form circuit patterns.

  4. Drying

    Remove solvent from the printed paste to prevent defects during firing.

  5. High-Temperature Firing

    Fire at high temperature to burn off organic materials and achieve strong adhesion and conductivity.

  6. Resistor or Dielectric Layer Printing

    Print resistor or dielectric paste as required to build functional layers.

  7. Secondary Firing

    Fire again to stabilize th resistor or dielectric layer and ensure performance and reliability.

  8. Surface Finishing

    Apply surface finishing such as Ag, Au, or other coatings to improve solderability and corrosion resistance.

  9. Electrical Testing & lnspection

    Perform electrical tests and visual inspection to ensure the product meets quality standards.

Depending on product requirements, multiple printing and firing cycles can be performed to multilayer circuit structures.Typical thick film circuit configurations include:

•Single-Sided Circuits
•Double-Sided Circuits
•Multilayer Thick Film Circuits
•Ceramic Heater Circuits
•Resistor Networks

Ceramic-to-Metal Brazing

Because ceramics and metals have significantly different thermal expansion coefficients, surface properties, and material structures, they cannot be joined using conventional welding methods.A typical ceramic brazing process includes:
  1. 3D Ceramic Structure

    High precision 3D ceramic structure manufacturing.

  2. Seed Layer Sputtering
    (Ti/Cu, TiW/Cu, Cr/Cu)

    Apply metallization layer to a strong bond between ceramic and metal.

  3. Photoresist Coating

    Nickel plating improves solderability,corrosion resistance and bonding reliability.

  4. Exposure & Development

    High temperature vacuum brazing to achieve strong and reliable ceramic-to-metal bonding.

  5. Copper Electroplating

    Perform helium leak test to ensure hermetic sealing performance meets specifications.

  6. Photoresist Stripping

    Perform helium leak test to ensure hermetic sealing performance meets specifications.

  • Common Metallization Technologies

    •Mo-Mn Metallization
    •W-Mn Metallization
    •Active Metal Brazing (AMB)

  • Common Brazing Alloys

    •AgCu (Silver-Copper)
    •AgCuTi (Silver-Copper-Titanium)
    •AuSn (Gold-Tin)
    •AuGe (Gold-Germanium)
    •AuCu (Gold-Copper)

The metallization layer serves as an interface between the ceramic and metal components, creating a strong and reliable metallurgical bond.
電話 : 03-5905018
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  • 特別關鍵字

    Ceramic Substrate,Ceramic PCB,DPC Ceramic Substrate,DBC Ceramic Substrate,AMB Ceramic Substrate,Thick Film Printing,Ceramic Metallization,Direct Bonded Copper,Active Metal Brazing,High Thermal Conductivity Ceramic,Power Module Substrate,Ceramic Circuit Board,Thin Film Metallization,Electronic Ceramics,Thermal Management