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  1. EXCELLENT THERMAL MANAGEMENT

    High thermal conductivity for efficient heat dissipation

  2. HIGH VOLTAGE INSULATION

    Superior dielectric properties ensure electrical reliability

  3. HIGH RELIABILITY

    Stable performance in harsh environments

  4. COMPACT & HIGH POWER DENSITY

    Enabling smaller size and higher power output

OUR CERAMIC PCB
TECHNOLOGIES

  1. Ceramic-to-Metal Brazing

    Custom ceramic-to-metal assemblies and vacuum brazing solutions
  2. DPC

    Fine-line ceramic substrates for semiconductor and RF applications
  3. DBC

    High current and high power ceramic solutions for EV and industrial power electronics
  4. AMB

    Enhanced reliability ceramic substrates for harsh operating environments
  5. Thick Film Printing

    Cost-effective ceramic circuitry for hybrid electronics

APPLICATIONS

  1. EV POWER ELECTRONICS
  2. SEMICONDUCTOR PACKAGING
  3. RF & MICROWAVE
  4. LED THERMAL MANAGEMENT
  5. AEROSPACE & DEFENSE
  6. MEDICAL EQUIPMENT
LEARN MORE

MATERIALS EXPERTISE

  1. ALUMINUM NITRIDE (AIN)

    High thermal conductivity up to 170 W/mK

  2. ALUMINA (Al₂O₃)

    Cost-effective solution with excellent electrical insulation

  3. ALUMINUM NITRIDE (SI₃N₄)

    Exceptional mechanical strength and thermal shock resistance

LEARN MORE

WHY CHOOSE TENSKY

  1. ENGINEERING-DRIVEN SOLUTIONS

    Application-oriented technical support

  2. GLOBAL CERAMIC PCB RESOURCES

    Access to qualified global manufacturing resources

  3. TECHNICAL CONSULTATION

    Material selection and design optimization support

  4. FAST PROTOTYPING SERVICE

    Rapid sampling and pilot production support

  5. GLOBAL PROJECT EXPERIENCE

    Serving customers in Europe, North America and Japan

  6. RELIABLE SUPPLY CHAIN INTEGRATION

    Effective supply chain management and on-time delivery

Comparison of DPC, DBC, and AMB Technologies

  1. Item
  2. DPC
  3. DBC
  4. AMB
  5. Circuit Precision
  9. Fine Pattern Capability
  13. High-Frequency Performance
  17. Thermal Performance
  21. Copper Thickness Capability
  25. Current Carrying Capacity
  29. Power Module Applications
  33. Optical Communication Applications
  37. Precision Packaging Applications
  41. Manufacturing Cost
店家商品
電話 : 03-5905018
  • 服務項目

  • 特別關鍵字

    Ceramic Substrate,Ceramic PCB,DPC Ceramic Substrate,DBC Ceramic Substrate,AMB Ceramic Substrate,Thick Film Printing,Ceramic Metallization,Direct Bonded Copper,Active Metal Brazing,High Thermal Conductivity Ceramic,Power Module Substrate,Ceramic Circuit Board,Thin Film Metallization,Electronic Ceramics,Thermal Management