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Material Comparison

  1. Item
  2. Unit
  3. ALN
  4. 96%Al2O3
  5. SI₃N₄
  6. Colour
  7. -
  8. Gray
  9. White
  10. Gray
  11. Density
  12. g/cm³
  13. ≥3.33
  14. ≥3.7
  15. ≥3.2
  16. Thermal Conductivity
  17. 20℃，W/(m·K)
  18. ≥170
  19. ≥24
  20. ≥80
  21. Dielectric Constant
  22. 1MHz
  23. 8~10
  24. 9~10
  25. 7.8
  26. Dielectric Strength
  27. KV/mm
  28. ≥17
  29. ≥17
  30. ≥32
  31. Flexural Strength
  32. MPa
  33. ≥450
  34. ≥350
  35. ≥700
  36. Camber
  37. Length‰
  38. ≤2.5‰
  39. ≤3‰
  40. ≤3‰
  41. Surface roughness Ra
  42. μm
  43. ≤0.6
  44. ≤0.75
  45. ≤0.6
  46. Water absorption
  47. %
  48. 0
  49. 0
  50. 0
  51. Volume resistivity
  52. 20℃，Ω.cm
  53. ≥10¹³
  54. ≥10¹⁴
  55. ≥10¹³
  56. Thermal expansivity
  57. 10-6/℃
  58. 20~300℃
    300~800℃
  59. 6.5~7.5
    2.5~3.5
  60. 25~300℃
    2.5~2.8
  61. Parameter Composition Statement: Due to differences in formulation and sintering processes, the final product of ceramic objects may have slight errors in the material property values (Data Sheet), which is within the normal acceptable range. The data provided here is for reference and comparison purposes only and should not be interpreted as absolute engineering data. Actual data may vary depending on product configuration. This data does not constitute a guarantee of legal liability.

  1. Aluminum Nitride (AlN) Substrate

    • High Thermal Conductivity Ceramic Material for Advanced Ceramic PCB Applications

      Aluminum Nitride (AlN) is one of the most widely used advanced ceramic materials for high-power electronic applications due to its exceptional thermal conductivity, excellent electrical insulation, and thermal expansion coefficient closely matched to silicon devices.
      AlN ceramic substrates are widely applied in DPC (Direct Plated Copper), DBC (Direct Bonded Copper), and AMB (Active Metal Brazed) ceramic PCB manufacturing processes, making them an ideal choice for power electronics, semiconductor packaging, RF communication, and AI computing applications.

    • Key Material Properties
      1. Thermal Conductivity: 170–230 W/m·K
      2. Excellent Electrical Insulation
      3. Low Dielectric Constant
      4. Coefficient of Thermal Expansion (CTE) Close to Silicon
      5. Excellent Thermal Shock Resistance
      6. High Temperature Stability
      7. Outstanding Corrosion Resistance
      8. Suitable for High-Power and High-Reliability Applications
    • Engineering Advantages

  2. 96% Alumina (Al₂O₃) Substrate

    • Cost-Effective Ceramic Substrate for Reliable Electronic Applications

      96% Alumina (Al₂O₃) is one of the most widely used ceramic substrate materials in the electronics industry. It offers an excellent balance of electrical insulation, mechanical strength, chemical resistance, and manufacturing cost, making it the preferred choice for a wide range of electronic applications.
      96% Alumina substrates are suitable for Thick Film Printing and DPC (Direct Plated Copper) processes. Depending on design requirements and manufacturing capabilities, they may also be used in selected DBC ceramic substrate applications.

    • Key Material Properties
      1. Thermal Conductivity: Approximately 24 W/m·K
      2. Excellent Electrical Insulation
      3. High Mechanical Strength
      4. Excellent Wear and Corrosion Resistance
      5. Mature Manufacturing Process
      6. Cost-Effective for Volume Production
      7. High Dimensional Stability
      8. Excellent Chemical Resistance
    • Engineering Advantages

  3. Silicon Nitride (Si₃N₄) Substrate

    • Highest Reliability Ceramic Substrate for Advanced Power Electronics

      Silicon Nitride (Si₃N₄) is recognized as one of the most reliable advanced ceramic materials for high-power electronics. It offers outstanding mechanical strength, exceptional fracture toughness, excellent thermal shock resistance, and long-term reliability under severe operating conditions.
      Compared with conventional ceramic substrates, Si₃N₄ provides superior durability and thermal cycling performance, making it the preferred material for next-generation power modules used in electric vehicles, renewable energy systems, industrial automation, and aerospace electronics.
      Silicon Nitride ceramic substrates are primarily used in AMB (Active Metal Brazed) ceramic substrate technology for high-reliability power electronics.

    • Key Material Properties
      1. High Mechanical Strength
      2. Excellent Fracture Toughness
      3. Outstanding Thermal Shock Resistance
      4. Excellent Thermal Cycling Reliability
      5. High Electrical Insulation
      6. High Temperature Stability
      7. Long Service Life
      8. Suitable for Harsh Operating Environments
    • Engineering Advantages
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  • 特別關鍵字

    Ceramic Substrate,Ceramic PCB,DPC Ceramic Substrate,DBC Ceramic Substrate,AMB Ceramic Substrate,Thick Film Printing,Ceramic Metallization,Direct Bonded Copper,Active Metal Brazing,High Thermal Conductivity Ceramic,Power Module Substrate,Ceramic Circuit Board,Thin Film Metallization,Electronic Ceramics,Thermal Management