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Advantages

• Ultra-Fine Circuit Pattern Capabilityc

• Excellent High-Frequency Performance

• High Design Flexibility and Advanced Packaging Capability

  DPC technology supports：

  1. Micro Vias
  2. Fine-Pitch BGA Designs
  3. Multilayer Interconnect Structures
  4. High-Density Packaging

• Superior Thermal Management

Advantages

• Excellent Thermal Conductivity

• High Current-Carrying Capability

• Outstanding Thermal Cycling Reliability

  1. trong Metallurgical Bonding
  2. Excellent Thermal Shock Resistance
  3. Long Service Life
  4. Low Failure Rates

• High Voltage Resistance、Excellent Insulation Resistance、Excellent Heat Dissipation

Advantages

• Outstanding Thermal Cycling Reliability

• High Mechanical Strength

• Excellent Thermal Conductivity

• High Current-Carrying Capability

Advantages

• Cost-Effective Manufacturing

• High Design Flexibility

  Thick film technology supports printing of：

  1. Conductive Layers
  2. Resistors
  3. Capacitors
  4. Protective Coatings
  5. Insulation Layers

• Excellent Reliability

  Ceramic substrates naturally provide：

  1. High Electrical Insulation
  2. High Temperature Resistance
  3. Moisture Resistance
  4. Corrosion Resistance

• Ideal for Ceramic Heater Applications

Advantages

• Hermetic Sealing Capability

• Excellent High-Temperature Performance

• High Voltage Resistance、Excellent Insulation Resistance、Low Leakage Current、Stable Electrical Performance

• Long-Term Reliability

Ceramic-to-metal brazed assemblies can withstand

1. 

   Thermal Cycling

2. 

   Vacuum Environments

3. 

   High Humidity Conditions

4. 

   Corrosive Atmospheres