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Advantages

• Ultra-Fine Circuit Pattern Capability

• Excellent High-Frequency Performance

• High Design Flexibility and Advanced Packaging Capability

  DPC technology supports:

  1. Micro Vias
  2. Fine-Pitch BGA Designs
  3. Multilayer Interconnect Structures
  4. High-Density Packaging

• Excellent Thermal Management

Advantages

• Excellent Thermal Management

• High Current-Carrying Capability

• Outstanding Thermal Cycling Reliability

• Strong Metallurgical Bonding

• Excellent Thermal Shock Resistance

• Long Service Life

• High Dielectric Strength

• Excellent Electrical Insulation

• Efficient Heat Dissipation

Advantages

• Outstanding Thermal Cycling Reliability

• High Mechanical Strength

• Excellent Thermal Management

• High Current-Carrying Capability

Advantages

• Cost-Effective Manufacturing

• High Design Flexibility

  Thick film technology supports printing of:

  1. Conductive Layers
  2. Resistor Patterns
  3. Dielectric Layers
  4. Protective Coatings
  5. Insulation Layers

• Excellent Reliability
  Ceramic substrates provide:

  1. High Electrical Insulation
  2. High Temperature Stability
  3. Low Moisture Absorption
  4. Good Chemical Stability

• Ideal for Ceramic Heater Applications

Advantages

• Hermetic Sealing Capability

• Excellent High-Temperature Performance

• High Dielectric Strength

• Excellent Electrical Insulation

• Low Leakage Current

• Stable Electrical Performance

• Long-Term Reliability

Ceramic-to-metal brazed assemblies can be designed for demanding environments including:

1. 

   Thermal Cycling

2. 

   Vacuum Environments

3. 

   High Humidity Conditions

4. 

   Corrosive Atmospheres