MENU
免責聲明
本網站僅提供窩客幫資訊參考平台， 並不涉入其中任何諮詢、交易。本網站對各該窩客幫相關資訊亦不作任何實質或形式上之審查。本網站中所載一切窩客幫的資訊、文字、照片、圖形 、產權、廣告內容、或其他資料（以下簡稱『內容』）。無論其為公開張貼或私下傳送，若有不實或違法情事，均為『內容』提供者之責任，窩客幫概不負責也不承擔任何法律責任。

ABOUT Tensky International

Advanced Ceramic PCB & Thermal Management Solutions Since 2007

Founded in 2007, Tensky International Co., Ltd. is a specialized provider of advanced Ceramic PCB technologies, ceramic metallization solutions, and thermal management engineering services. With extensive expertise in ceramic materials, thermal design, and manufacturing processes, Tensky has evolved from a precision ceramics manufacturer into a trusted engineering partner for high-performance electronic applications worldwide.
As power electronics, AI computing, semiconductor packaging, RF communications, and renewable energy technologies continue to advance, the demand for superior thermal conductivity, electrical insulation, and long-term reliability has never been greater. Since entering the high-power Ceramic PCB market in 2009, Tensky has continuously developed advanced ceramic substrate technologies designed for high heat flux, high voltage, high frequency, and harsh operating environments.
Today, Tensky serves customers across Taiwan, China, Japan, Korea, Singapore, the United States, Germany, France, and other global markets. Our products and engineering solutions are widely utilized in EV power modules, AI servers, high-power LED systems, RF and microwave communications, semiconductor packaging, industrial automation, medical devices, aerospace systems, and defense electronics.

Core Technologies & Products

  1. Ceramic PCB Solutions

    Tensky provides comprehensive Ceramic PCB manufacturing and engineering services, including:

    •DPC Ceramic PCB (Direct Plated Copper)
    •DBC / AMB Ceramic Substrates
    •Thick Film Printed Ceramic Circuits
    •High Thermal Conductivity Ceramic Substrates
    •Custom Ceramic Circuit Design
    •Multilayer and Advanced Ceramic PCB Structures

    By integrating material selection, circuit design, and manufacturing technologies, we help customers achieve superior thermal performance, electrical insulation, and long-term product reliability.
    Our Ceramic PCB solutions are designed to meet the requirements of high-power electronics, semiconductor packaging, RF communication systems, AI infrastructure, automotive power electronics, and other mission-critical applications.

  2. Ceramic Metallization & Advanced Packaging Technologies

    In addition to Ceramic PCB manufacturing, Tensky offers advanced ceramic metallization and ceramic-to-metal joining technologies for semiconductor packaging, vacuum devices, hermetic packages, high-voltage systems, and demanding industrial applications. Our capabilities include:

    •Ceramic Metallization
    •Mo/Mn Metallization
    •Tungsten Metallization (W Metallization)
    •Nickel Plating (Ni)
    •Gold Plating (Au)
    •Active Brazing
    •Vacuum Brazing
    •Hermetic Packaging Solutions

    These technologies enable reliable bonding between ceramic and metallic materials, providing exceptional performance in high-temperature, high-vacuum, high-voltage, and high-reliability environments.

Innovation Driven. Engineering Focused.

At Tensky, we believe advanced ceramic materials will continue to play a critical role in the future of electric vehicles, semiconductor technologies, artificial intelligence, high-frequency communications, aerospace systems, defense electronics, and renewable energy applications.

Our mission extends beyond manufacturing Ceramic PCBs. We are committed to becoming a long-term engineering partner, helping customers solve complex thermal, packaging, and reliability challenges through innovative ceramic technologies and customized engineering solutions.

From material selection and circuit design to thermal optimization, ceramic metallization, and production manufacturing, Tensky provides comprehensive support throughout the product development cycle.

In addition, Tensky continues to invest in precision ceramics and advanced surface engineering technologies as complementary solutions to our Ceramic PCB business, providing customers with broader material expertise and integrated technology support for next-generation applications.

電話 : 03-5905018
  • 服務項目

  • 特別關鍵字

    Ceramic Substrate,Ceramic PCB,DPC Ceramic Substrate,DBC Ceramic Substrate,AMB Ceramic Substrate,Thick Film Printing,Ceramic Metallization,Direct Bonded Copper,Active Metal Brazing,High Thermal Conductivity Ceramic,Power Module Substrate,Ceramic Circuit Board,Thin Film Metallization,Electronic Ceramics,Thermal Management