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Mainstream Ceramic Metallization and Circuit Fabrication Processes
1. Thick Film Process: A conductive layer is formed by screen printing metal paste and high-temperature sintering.
Advantages: Low cost, suitable for mass production.
Disadvantages: Lower precision.
2. Thin Film Process (DPC, also known as Direct Plated Copper): High-precision circuits are formed using sputtering, electroplating, and lithography techniques.
Advantages: Suitable for high-precision, high-resolution, and high-frequency applications, LED, 5G, and optical communication applications.
Disadvantages: Higher cost.
3. Direct Bonded Copper (DBC): Copper foil is directly bonded to ceramic to form a high thermal conductivity substrate.
Features: High current carrying capacity and standard process for power module IGBTs.
4. Active Metal Brazing (AMB): High-strength bonding using active metals.
Features: High reliability and suitable for automotive and aerospace applications.
V. Process Comparison
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Common Ceramic Materials
1. Alumina (Al₂O₃): Low cost, widely used in general electronic and automotive electronic products.
2. Aluminum Nitride (AlN): High thermal conductivity (170–200 W/mK), suitable for high-power applications.
3. Silicon Nitride (Si₃N₄): High strength and impact resistance, the preferred material for military, aerospace, and automotive electronics.
4. Silicon Carbide (SiC): High temperature resistance and high thermal conductivity, with micro-conductivit -
Why is Ceramic Metallization Necessary?
Advantages of Ceramic Materials: High insulation, high heat resistance, high mechanical strength, and excellent heat dissipation.
However, their limitations: They cannot conduct electricity directly and cannot be soldered. Therefore, metallization processes are required to enable ceramics to be used in: power modules (IGBT/SiC), semiconductor equipment, vacuum connectors, LED heat sinks, and aerospace hermetically sealed components. -
What is Ceramic Metallization?
Ceramic metallization is a key technology that involves forming a conductive metal layer on the surface of a ceramic substrate, enabling it to conduct electricity, be soldered, and be packaged. Because ceramic materials themselves possess high insulation and high-temperature resistance, direct electrical connections are not possible. Through metallization processes, ceramics can be applied to high-end electronics and semiconductor fields.
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