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AMB (Active Metal Brazing) is an advanced ceramic-to-metal bonding technology used to manufacture high-performance ceramic substrates for demanding electronic applications. The process uses an active brazing alloy containing reactive elements such as titanium to promote direct bonding between ceramic materials and copper, without requiring a separate conventional metallization process such as DPC.

AMB substrates provide high bonding strength, reliable electrical insulation, excellent thermal performance, and strong resistance to thermal cycling. These characteristics make AMB particularly suitable for demanding environments where components are exposed to high temperatures, high power densities, and repeated thermal stress.

Typical ceramic materials used for AMB substrates include silicon nitride (Si₃N₄), aluminum nitride (AlN), and alumina (Al₂O₃). The ceramic material, copper thickness, and brazing system can be selected according to the thermal, electrical, mechanical, and reliability requirements of the application.

AMB technology is widely used in electric vehicle power modules, IGBT and SiC power modules, railway power systems, renewable energy equipment, industrial power electronics, and other high-reliability applications requiring robust ceramic-to-metal bonding and thermal management.